Centerless Grinding Wheel

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Centerless Grinding Wheel Specification

Abrasive
Very Tough Abrasive

Thickness
6.6 Millimeter (mm)

Product Type
Diamond Wheel

Shape
Round

Application
Angular Head Grinding

Centerless Grinding Wheel Trade Information

Minimum Order Quantity
1 Piece

Payment Terms
Cash in Advance (CID), Cash Advance (CA)

Supply Ability
20 Pieces Per Day

Delivery Time
1 Week

Packaging Details
Box.

Main Export Market(s)
Western Europe, Australia, North America, South America, Eastern Europe, Middle East, Africa, Central America, Asia

Main Domestic Market
All India

About Centerless Grinding Wheel

Centerless Grinding Wheel

Resin Bond is a very versatile type of bond. Its range of application covers more than half the machining tasks for which Diamond and CBN grinding tools can be used. The outstanding features of Resin Bond are that it enables large cutting volumes and ensures soft and cool grinding.

Resin bond, or organic compound, bonds are more shock resistant than vitrified bonds and are generally operated at higher peripheral speeds. Most resin bond wheels are used for fast stock removal in the metal fabrication and foundry markets.

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