Resin Bond Centerless Grinding Wheel
Resin Bond Centerless Grinding Wheel

Resin Bond Centerless Grinding Wheel

Resin Bond Centerless Grinding Wheel Specification

  • Thickness
  • 5-15 Millimeter (mm)
  • Application
  • Heavy Duty Work
  • Product Type
  • Grinding Wheel
  • Abrasive
  • Long Life
  • Shape
  • Round
 

Resin Bond Centerless Grinding Wheel Trade Information

  • Minimum Order Quantity
  • 1 Piece
  • Payment Terms
  • Cash in Advance (CID), Cash Advance (CA)
  • Supply Ability
  • 20 Pieces Per Day
  • Delivery Time
  • 1 Week
  • Packaging Details
  • Box.
  • Main Export Market(s)
  • Australia, North America, South America, Western Europe, Middle East, Central America, Asia, Eastern Europe, Africa
  • Main Domestic Market
  • All India
 

About Resin Bond Centerless Grinding Wheel

Resin Bond is avery versatile type of bond. Its range of application covers more than half themachining tasks for which Diamond and CBN grinding tools can be used. Theoutstanding features of Resin Bond are that it enables large cutting volumesand ensures soft and cool grinding.

Resin bond, ororganic compound, bonds are more shock resistant than vitrified bonds and aregenerally operated at higher peripheral speeds. Most resin bond wheels are usedfor fast stock removal in the metal fabrication and foundry markets.

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