Resin Bond Centerless Grinding Wheel

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Resin Bond Centerless Grinding Wheel Specification

Shape
Round

Thickness
6.6 Millimeter (mm)

Application
Angular Head Grinding

Product Type
Diamond Grinding Wheel

Abrasive
Very Tough Abrasive

Resin Bond Centerless Grinding Wheel Trade Information

Minimum Order Quantity
1 Piece

Payment Terms
Cash in Advance (CID), Cash Advance (CA)

Supply Ability
20 Pieces Per Day

Delivery Time
1 Week

Packaging Details
Box.

Main Export Market(s)
Australia, South America, Eastern Europe, Western Europe, Middle East, Central America, Africa, Asia, North America

Main Domestic Market
All India

About Resin Bond Centerless Grinding Wheel

Resin Bond Centerless Grinding Wheel

Resin Bond is a very versatile type of bond. Its range of application covers more than half the machining tasks for which Diamond and CBN grinding tools can be used. The outstanding features of Resin Bond are that it enables large cutting volumes and ensures soft and cool grinding.

Resin bond, or organic compound, bonds are more shock resistant than vitrified bonds and are generally operated at higher peripheral speeds. Most resin bond wheels are used for fast stock removal in the metal fabrication and foundry markets.

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