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Resin Bond Centerless Grinding Wheel

Resin Bond Centerless Grinding Wheel

Product Details:

  • Thickness 6.6 Millimeter (mm)
  • Shape Round
  • Application Angular Head Grinding
  • Product Type Diamond Grinding Wheel
  • Abrasive Very Tough Abrasive
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Resin Bond Centerless Grinding Wheel Price And Quantity

  • 1 Piece

Resin Bond Centerless Grinding Wheel Product Specifications

  • Diamond Grinding Wheel
  • 6.6 Millimeter (mm)
  • Very Tough Abrasive
  • Angular Head Grinding
  • Round

Resin Bond Centerless Grinding Wheel Trade Information

  • Cash in Advance (CID) Cash Advance (CA)
  • 20-50 Piece Per Day
  • 1 Week
  • Box.
  • Australia South America Eastern Europe Western Europe Middle East Central America Africa Asia North America
  • All India

Product Description

Resin Bond Centerless Grinding Wheel

Resin Bond is a very versatile type of bond. Its range of application covers more than half the machining tasks for which Diamond and CBN grinding tools can be used. The outstanding features of Resin Bond are that it enables large cutting volumes and ensures soft and cool grinding.

Resin bond, or organic compound, bonds are more shock resistant than vitrified bonds and are generally operated at higher peripheral speeds. Most resin bond wheels are used for fast stock removal in the metal fabrication and foundry markets.

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